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[Problem-Solving Case] Reflow Heat Countermeasures

A case where a custom socket was mounted on the circuit board, and after reflow, components were attached to the socket!

We would like to introduce a case study regarding the "reflow heat countermeasures" we addressed. The customer company faced a challenge where they were soldering components that could not withstand reflow heat onto the circuit board after reflow, and they wanted to reduce labor costs. We implemented a custom socket on the circuit board tailored to the lead diameter, pitch, and pattern of the components. After reflow, the components were attached to the socket, resolving the issue. [Case Overview] ■ Customer's Concern - They were soldering components that could not withstand reflow heat onto the circuit board after reflow and wanted to reduce labor costs. ■ Solution - We implemented a custom socket on the circuit board tailored to the lead diameter, pitch, and pattern of the components, allowing them to attach the components to the socket after reflow. *For more details, please download the PDF or feel free to contact us.

• Company：アイクレックス
• Price：Other

• Other semiconductors